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Dell ISG Hardware Engineering Graduate Intern

Dell Inc. Austin/Round Rock, Texas or Hopkinton, Massachusetts
Posted 1 day, 1 hour ago
Deadline: Not specified
Internship Entry Level Engineering

Dell ISG Hardware Graduate Engineering Intern 2026

The reputation of Dell Technologies for delivering award-winning hardware is legendary and our Hardware Engineering team is at the heart of it. We design and develop analogue as well as digital hardware products – not just computer or network hardware devices but peripherals too. Recognized for our high level of technical expertise in a variety of engineering disciplines, we’re involved across the development lifecycle – from research to the building, testing and delivery of completed products. Innovators in our field, we lead the way in exploring new concepts, approaches, processes, materials and components.

Join us as a Hardware Engineering Graduate Intern on our Infrastructure Solutions Group team in possible locations of Austin/Round Rock, Texas or Hopkinton, Massachusetts to do the best work of your career and make a profound social impact.

What you’ll achieve

The Infrastructure Solutions Group (ISG) team is responsible for designing the full portfolio of Dell’s server, storage, and networking switch infrastructure with a heavy emphasis on delivery of our latest industry-leading AI-focused products.  We are responsible for the hardware, firmware, and software that makes these products operate and meet our customers’ needs.

Dell is committed to fair and equitable compensation practices. The pay range for this position is $46.33-50.60.

Requirements

Currently enrolled in a Masters or MBA degree in computer, Electrical or Mechanical Engineering, Technology or Computer Science related degree with a graduation date of December 2026 or May 2027.
At least one scripting language such as Python, PERL, or bash
Understanding of hardware and software interactions, and able to apply this understanding to resolve issues
Reading and understanding engineering specifications, data sheets and other technical documents
Strong mechanical aptitude, experience in design, thermals and/or controls; experience in Creo/Solidworks, Flowtherm/Icepack, and/or Simulink modeling (Mechanical Engineers)
Desirable Requirements

Direct experience with x86 or ARM computer architectures and chipsets, schematic tools, PCB layout tools, oscilloscopes, and signal generators
Various I/O protocols, such as PCIe, SAS, SATA, Gigabit Ethernet and IPSec; High speed design experience (> 1Gbs)
Demonstrate AI literacy and a proactive approach to leveraging AI tools to optimize hardware design, validation, and testing workflows, enhance system performance analysis, and accelerate innovation.

Company Size
1000+ employees
Employment Type
Internship
Work Mode
On-site (Austin/Round Rock, Texas or Hopkinton, Massachusetts)
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Location

Austin/Round Rock, Texas or Hopkinton, Massachusetts